than 63Sn/37Pb, equipment concerns should be considered. Many new lead-free alloy compositions are being released. When testing the alternative solder compositions the user must consider several issues: • Is the material selected going to be compatible with the plating on the sensor leads or the finish specified on the circuit board?Data Sheet (Rev 0 - 02/15/08) SMCTAA65N14A10 275 Great Valley Parkway Malvern, PA 19355 Ph: 610-407-4700 Notes: 1. Case Exterior Assumed to be 0.002" of 63sn/37pb solder applied directly to Anode. Typical Performance Curves (unless otherwise specified) Figure 1. On-State Characteristics Figure 2. On-State Characteristics Figure 3.
Solder Powder Technical Data Sheet Alloy Composition: AMT's powders are produced using only the highest quality virgin materials. All our powders exceed the J -STD-006 specification. Oxygen Content: All AMT solder powders are atomized in a controlle d atmosphere to minimize oxygen content. Typical values for 63Sn/37Pb are listed below.the following alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, 60Sn/Pb40, 43Sn/43Pb/14Bi, 42Sn/58Bi and Sn100. Powder Distribution Available Packaging ... Amtech data sheet
Tin/Lead: 63Sn/37Pb Specifications PGA Sockets and Adapters Standard and interstitial footprints Low insertion force (1oz. average per pin) Hundreds of footprints and terminal styles Also available with molded and FR-4 insulators For applications that require low profile and customizable PCB configurations, Peel-A-Way® Removable Terminal Lead-Bearing Water Soluble Solder Paste. Our 8800-series Lead-Bearing Water Soluble Solder Paste is available with the Sn63/Pb37 Tin/Lead Alloy. This product is currently available in Type 3, Type 4 and Type 5 mesh sizes. The solder paste can be packaged as ready to use squeezers, syringes, jars, or cartridges.ALPHA® WS-709 Solder Paste 63Sn/37Pb 90-3-M13 Page: 4/12 Section 5. Fire-fighting measures Promptly isolate the scene by removing all persons from the vicinity of the incident if there is a fire. No action shall be taken involving any personal risk or without suitable training. Hazardous thermal decomposition products Specific hazards arising
4300 63Sn/37Pb, Type 3, 35 gram syringe: Part Number: 11080 4300 62Sn/36Pb/2Ag, Type 3, 500 gram jar: Part Number: 11040 4300 62Sn/36Pb/2Ag, Type 4, 500 gram jar: Part Number: 11045Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC... Solder Ribbon -- Tin-Lead Ribbon - 63Sn 37Pb Most widely used SnPb solder for electronics.
safety data sheet supply co. - solder wire cored 63sn/37pb alloy, ra-32 flux document nbr: 084144 class c parts ids 21567 safety data sheet alpha safety data sheet-----section 1. identification -----product name: solder wire cored 63sn/37pb alloy, ra-32 flux product code: m063ra32 product type: solid. date of issue/date of revision: may 15 2015. PRODUCT DATA SHEET WF-9955 Wave Solder Flux Form No. 98689 R1 Introduction Indium Corporation's new WF-9955 soldering flux is an updated version of Indium Corporation's best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORL0. It has no intentionally added halogens, no rosin, and
♦ Formula 90: RMA Formulation ♦ Class 1 Alloy: 63Sn/37Pb ♦ Type 3 Powder: -325/+500 Mesh Powder ♦ Metal Content: 85% Formulated for harsh operating environments.Buy CHIP QUIK - Solder Paste No Clean 63Sn/37Pb in 10cc Syringe 35g (T3) at CPC Farnell. Buy now to get the best prices with fast delivery on all CHIP QUIK products.
Electronic alloys CRM alloys for electronics are made of high quality virgin materials, meeting the highest requirements of the regulations. CRM Synergies follows a strict quality controls in order to increase the performance of their alloys and minimize the appearance of the typical welding defects.Kester's reputation as the leader in wire solder comes from its proprietary method of manufacturing first patented over ninety years ago and continually improving over the years. Electronic alloys CRM alloys for electronics are made of high quality virgin materials, meeting the highest requirements of the regulations. CRM Synergies follows a strict quality controls in order to increase the performance of their alloys and minimize the appearance of the typical welding defects.n2 Soldering proﬁle for Eutectic solder (63Sn/37Pb) (Limit proﬁle: refer to n1) oSoldering Iron Standard Proﬁle Temperature of soldering iron tip Soldering time Soldering iron power output 350±10°C 3sec. max. 30W max. 1 time Cycle of soldering iron Peak temperature (T5) Peak temperature (T3) Temperature Profile Notice (Storage and Operating Conditions)
63Sn 37Pb Others: 90Pb 10Sn 92.5Pb 5S 2.5Ag 95Pb5Sb Other • Wide reflow process window • Superior tack strength. NC-SMQ75 62Sn 36Pb 2Ag 63Sn 37Pb Others: 90Pb 10Sn 92.5Pb 5S 2.5Ag 95Pb 5Sb Other • Ultra-low residue • Nitrogen reflow • Trouble-free probe testing. Lead containing water wash solder pastes: Flux vehicles: Available alloys: Description: Data sheet: MSDSAMTECH manufactures a low-oxide, spherical and uniformly sized powder. 4300 is available in the following alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, 60Sn/Pb40, 43Sn/43Pb/14Bi and 42Sn/58Bi. Powder Distribution Available Packaging The following packaging options are available for stencil printing and dispensing applications:
• Ball Grid Array Material: 63Sn/37Pb 0.030" Electrical Connection Pin Connection 1 Enable/Disable 2 Ground 3 Ground 4 Output 5 Output Complement 6 VCC CRYSTAL CLOCK OSCILLATORS Data Sheet 0939C Rev. D②共晶はんだ（63Sn／37Pb組成） （限界プロファイルは鉛フリーはんだ用を参照してください。） はんだこて 標準 こて先温度 はんだ時間 こて電力 350±10℃ 3sec. max. 30W max. 1回 回数 温度プロファイル T13J.pdf 2017.9.1
Material Safety Data Sheet SRM1129 - Solder (63Sn-37Pb) Using the links below, select the format you prefer to view the MSDS. (Note: The Adobe Acrobat Reader must be installed on your computer to support viewing in PDF format. If you do not currently have the Adobe Acrobat Reader installed on your computer, visit the Adobe website.)Wafer Bumping 프로세스와 칩 레벨 인터커넥트 기술 서비스 칩과 기판 간의 전기적, 기계적 연결은 모든 Flip Chip 패키지 혹은 Wafer Level
This product data sheet is provided for general information only. It is not intended, and shall not be construed, to warrant or guarantee the performance of the products described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices.Product description The INFRARED IC HEATER T962 is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use.
Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: AAU -1 Lead Coplanarity 0.010 inch (0.25 mm) Weight 8.5 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A 2.30 2.50 2.70 A1 0.40 0.50 0.60ALPHA® WS-709 Solder Paste 63Sn/37Pb 90-3-M13 Page: 4/12 Section 5. Fire-fighting measures Promptly isolate the scene by removing all persons from the vicinity of the incident if there is a fire. No action shall be taken involving any personal risk or without suitable training. Hazardous thermal decomposition products Specific hazards arisingData Sheet 0939A 357 Beloit Street, P.O. Box 457, Burlington, WI 53105-0457 U.S.A. Phone 262/763-3591 FAX 262/763-2881 Email: [email protected] www.nelfc.com